IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

The transfer molded DIP-IPM was first introduced in 1998 to address the rapidly growing demand for cost-effective motor control in consumer appliance applications. These devices soon became widely ...

The IC is a small piece of silicon that needs to be protected from and interfaced to the outside world. This is the role of the package. The package not only protects the semiconductor from mechanical ...